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A Systematic Approach for Creating a System-In-Package (SIP)
Keywords: System In A Package, Miniaturization of Electronics, Increased Functionality, Decreased Size
Over the past several decades the quest to design electronics that boast ever increasing capabilities while continuously decreasing their size and weight a series of new packaging solutions have been developed. As the need for more functionality in less real estate grew further Multiple Chip Modules (MCM) were no longer satisfactory in many applications. Today many applications call for a highly integrated packaging approach which incorporates often many different functionalities into one package. In situations where time to the market for SOC (System on a Chip) is too slow or too costly the approach of System-in-a-package (SIP) can be the ideal solution. Today's packaging roadmap calls for new 3D structures and materials such as high-k dielectric. The second element is advanced packaging. New technologies, such as the assembly of Silicon chips onto other Silicon chips, have been developed. The third element has been the development of design tools that allow a seamless system design for engineers used to IC design tools and flows. Testing is the fourth element and is one of the economical enablers of the technology. The key words are “known good die”, RF test, system test. In this paper we present a systematic approach to designing highly integrated and miniaturized SIP packages. This approach enables rapid design, prototyping and going into production while achieving a new level of integration, miniaturization and reliability. Finally, a case study takes the audience thru a maturity cycle of a SIP for a wireless application.
Sam Sadri, Engineer
NxGEN Electronics Inc.
San Diego, CA
USA


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