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Underfill for Ultra-Low Bumped (10) 3D Package
Keywords: Underfill, Reliability, 3D Package
In order to meet the demand of high speed, more memory, more function and low cost, 3D package is hot now. The bump height of 3D package is now down from 80μ to 10μ. When the bump diameter is 20-40μ and height 10μ, the process and reliability are obvious issues. It is well known that underfill can resolve the reliability issue for 3D package, however it is very difficult for traditional flip chip underfill or board level underfill flow into 10μ multi-layer which is schemed in Fig. 1 without reliability issue. YINCAE Advanced Materials, LLC has successfully developed unique SMT 158 underfill series, which not only function as traditional underfill such as flip chip but also work very well for 10μ bump height 3D package application. SMT 158 underfill series allow fast flow into 3D package and fast cure. After underfiling, there are no voids observed which is shown in Fig. 2. More reliability data will be presented in the full paper and presentation. Fig.1 Fig.2
Mary Liu, Engineer
YINCAE Advanced Materials, LLC
Troy, NY
USA


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