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Leveraging the Insatiable Need for Smaller Microelectronic Packages: Opportunities for Medical Devices
Keywords: Minaturization, SIP, Package thinkness trends
The mobile electronics industry continues to drive ever-increasing functionality in an ever-decreasing footprint. Higher functionality can be obtained by adding more transistors per unit Si area, by utilizing multi-chip modules, or by combining chips and discretes in a system-in-package approach. Here, we focus on improving functional density of analog circuits by shrinking package volume and applying these lessons to medical applications. Sensors, logic, Rf, power management, supplies, and AD converters are only a partial list of analog circuitry commonly found in applications, such as mobile phones, where the physical design space is severely restricted. WCSP, BGA and QFN packages have thrived in this environment not only because these package types compare favorably in size to leaded package types but also because each has a viable technology paths to enable further volume shrinks. First, we review the history with regards to the outward physical dimensions (x, y and z dimensions) of microelectronic packaging. Second, we will share some industry trends and discuss evolutionary miniaturization. Third, we show more novel package constructions (embedding, passives integration, SMT stacking) that demonstrate what is possible when size constraints dictate design choices.
Frank Stepniak,
Texas Instruments
Dallas, TX
USA


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