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High Performance and High Reliability Passives for Miniature Medical Devices based upon Silicon Technologies
Keywords: 3d, IPD, silicon
IPDIA is involved in Silicon based 3D-IPD advanced technology. This very flexible technology is using front-end IC processing techniques to integrate passive components such as inductors, resistors or capacitors into a silicon substrate. High value capacitors are at the forefront of IPDIA development program. First process generation with 25nF/mm2 and second generation reaching 80nF/mm2 have been in production for several years. The third generation with multiple metal-insulator-metal (MIM) layer stacks in the pores is reaching 250nF/mm2 and is being qualified now. These capacitors demonstrate very high performances in terms of stability (vs voltage, temperature,…), matching and reliability. To enable even higher integration, development activities are now focused on the next generations of high-density capacitors targeting ambitious 1µF/mm2. In this presentation, main characteristics of these high performance components will be described emphasizing on their capabilities, main applications and advantages versus discrete components.
Franck Murray, Engineer
IPDIA
Caen 14000,
France


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