Here is the abstract you requested from the Medical_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A Technique for Assembly and Packaging of Ultrathin, Flexible Sensors and Other Electronics for Medical Applications|
|Keywords: Wireless sensor, Ultrathin packaging, Wearable health monitor|
|A photoprinting technique for integrated circuit component assembly is described, which is capable of handling objects of any thickness or lateral dimension down to the micron scale at high speed. Using thinned silicon wafers or SOI, this allows for flexible, compact and inexpensive electronics with no compromise of performance. The process is illustrated with the latest work on a wireless electrocardiograph monitor.|
|Jayna Sheats, CTO
Waterloo, Ontario N2V 1B4,