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A Technique for Assembly and Packaging of Ultrathin, Flexible Sensors and Other Electronics for Medical Applications
Keywords: Wireless sensor, Ultrathin packaging, Wearable health monitor
A photoprinting technique for integrated circuit component assembly is described, which is capable of handling objects of any thickness or lateral dimension down to the micron scale at high speed. Using thinned silicon wafers or SOI, this allows for flexible, compact and inexpensive electronics with no compromise of performance. The process is illustrated with the latest work on a wireless electrocardiograph monitor.
Jayna Sheats, CTO
Terepac Corp.
Waterloo, Ontario N2V 1B4,

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