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Abstract Preview
Here is the abstract you requested from the Medical_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
| Laser Direct Structuring Method of Integrating Circuitry with Three-Dimensional Components |
| Keywords: LDS Technology, Materials, Design, Metallization Process |
| Laser Direct Structuring (LDS) is a process to produce circuit layouts on complex three-dimensional carrier structures to effectively reduce weight and fitting-space. Designers enjoy complete 3-D capability on free-form surfaces, greater freedom for redesigns, the possibility of using surface mount technology and significant cost reductions through elimination of the number of components, reduction of wires and interconnects and the resultant decrease in assembly times. This talk describes the LDS technology, materials, design considerations, the metallization process and numerous examples of applications currently in production or development. |
James Liddle, Director, Business Development
SelectConnect Technologies
Palatine, IL
USA |
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