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A Review of Flip Chip Ceramic CGA Packaging
Keywords: Flip Chip, CF package, BGA
This technical paper is intended to introduce the reader to the reliability of the CF line of ceramic packages. The CF package is a flip chip ceramic column grid area array (described in detail in the paper body) package which does not meet the classical DSCC description of a hermetic (metal sealed cavity ceramic) package but which does demonstrably meet all of the applicable screening, qualification testing, and reliability requirements of a full V-grade traditional hermetic assembly. The paper explores the reasons that the industry has gone from conventional wire bonding to flip chip solder connections between the die and the package substrate, why it is not possible to comply fully with current DSCC requirements and hermetically seal such an attached die within a hermetic cavity, and why the CF package can and will pass all the screening and reliability testing that typically qualifies a full hermetic part to the full intent of a V-flow product offering. The paper details the alternate screening performed on this construction to demonstrate that the parts so packaged will not exhibit infant mortality in space and critical military applications. It then presents classical group B, group C and group D testing of this construction methodology and shows that the flip chip ceramic column grid package is as reliable, if not more reliable, than a classic hermetic "tin can". The paper discusses and demonstrates the superiority of the column grid area array package to a ball grid area array package in the thermal cycling environments that are encountered in orbital and classical military and avionics applications. It demonstrated the fact that the columns introduce compliance into the situation and compensate for thermal coefficient mis-match between the ceramic package body and a host of varied printed circuit board construction alternatives. Finally the paper contains a list of further references and contact information for the users to pursue additional questions that will certainly be left.
Joseph Fabula,
Xilinx, Inc.
San Jose, CA
USA


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