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Ceramic Column Grid Array Durability in Rugged Environments
Keywords: column grid array , solder joint reliability , thermal cycle testing
With the need for more processing and data throughput, the packages for Processor and ASIC type grid array components has grown in size and I/O. Over the last five years the use of high density large I/O grid array components has grown significantly for the high – reliability military & space avionics markets. The challenge has been the “ruggedization” of these types of components for high vibration, shock and thermal cycles. A basic understanding of the high solder joint stress due to CTE mismatch between the component package (typically ceramic) and the printed wiring board (PWB) drive the “high–rel “market to the use to solder columns rather than the traditional solder balls. This presentation will show a historical test program that has evolved over several years to demonstrate the reliability / durability of various Ceramic Column Grid Arrays (CCGA) in extreme environments. The test results will start with a relatively low fidelity test project and develop into higher fidelity test scenarios of multiple components with different I/O and column styles. Test data has been collected for various package I/O from 256 to 1500, component substrates using Alumina and High CTE ceramics, different styles of columns using copper spiral wrap and cast technologies. Test environments included thermal cycling, vibration and limited shock environments of various levels enveloping typical space applications. Test results have demonstrated that the use of ceramic grid array components can survive rugged environments provided some basic design features are implemented to address CTE mis-match (between component and board) and board design features are incorporated to minimize deflection from vibration and shock environments.
Jerry Keller, Mechanical Engineering Manager
Honeywell Aerospace
Clearwater , FL

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