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Broadband Printing - Enhanced Solder Joint Reliability
Keywords: Broadband Printing, PCB, Reliability
Broadband printing, also known as Dynamic printing has become the new challenge for board assemblers. Broadband Printing is defined here, as the printing process that satisfies the solder paste volume need for a PCB with both miniature and larger components existing side by side. This creates a fundamental challenge in satisfying the solder paste need for both small and large components. Meeting the stringent requirements of High Reliability Military Specifications requires robust solder joints and requires the correct volume of paste to provide the right standoff height for compliant reliable joints. Board assembler, research institutes and consortium are considering many different approaches to provide a solution for this fundamentally, conflicting problem. Some of these approaches include step stencil, dual printing, combination of printing and dispensing etc… Clearly, there is no one approach that has surfaced to be the ultimate solution. Hence, research continues in this area to gain knowledge and empower board assembler to arrive at the most cost effective solution. This research looked at the capability of a single thickness stencil to satisfy the paste requirement for mixed components board by creative stencil design. The stencil designed included the following factors: stencil thickness, stencil technology and aperture design. Larger components apertures were systematically increased to 40% of their nominal size while miniature components were maintained at their nominal size. This paper introduces Volume Balancing in single level stencils.
Rick Love, Sales Manager
Cookson Electronics - Assembly Materials Group
Vancouver, WA
USA


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