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Low-Temperature Soldering Options for High-Reliability Hermetic Sealing
Keywords: Hermetic, Reliability, NanoFoil®
Hermetic seals have been widely used in a wide variety of electronics applications throughout the years. Reliability is a key requirement of devices made for military and aerospace applications due to the harsh environments in which the devices can operate and the need for longevity. Hermetic solder seals provide this level of reliability by protecting the sensitive packages from moisture and other airborne contaminants that would damage or compromise the device. There are three commercial off-the-shelf (COTS) solder materials that can meet these needs: 1) Gold Tin Eutectic 2) Indium 3) NanoFoil® All three of these materials have been used, not only in a variety of applications for military and aerospace, but also for medical and other commercial products. Gold/tin and indium have been used for many years in hermetic sealing applications and have proven high reliability. NanoFoil® is a relatively new technology that has also proven to provide additional benefits in processing. This paper will compare the gold/tin eutectic alloy (80Au/20Sn), indium, and the multilayered Reactive NanoFoil® materials using test data to show that each technology is viable high-reliability option for various hermetic sealing applications.
Christopher Nash, Southeast Technical Support Engineer
Indium Corporation
Clinton , NY
USA


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