Here is the abstract you requested from the MIL_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Automated Design Analysis: Accurately Capturing Warranty and End-of-Life Risks Early in Product Development|
|Keywords: reliability, software tool, predictive capability|
|It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the product development cycle is extremely costly. The worst case situation is discovering design problems after failures occur in the field. Designing for reliability has been easier said than done due in large part to the many competing interests involved in a design. For example, the designer is challenged with increasing the product performance while continually reducing the form factor. The reliability engineer may raise concerns about design risks, but without the ability to quantify the potential impact, they are often unable to meaningfully influence the design decisions. Implementing a newly developed reliability prediction analysis tool will forever change this equation. Before a single product is built, this valuable new tool enables the engineer to import the design files and quantitatively predict the life of the product according to the assumptions made for the user environment. The failure rate is predicted for thermal cycle fatigue of solder joints and plated through hole vias as well as shorting from conductive anodic filament (CAF) formation. The software will also produce a finite element analysis of the circuit boards showing regions susceptible to excessive board strain during vibration or shock events. The most value comes from the ability of the engineers to perform various “what if” scenarios to determine the impact of any number of design choices. • What if I change the mount point locations? • What if I change the via diameters, the spacing, or the copper thickness? • What if I change the laminate thickness or material selected? • What component is at highest risk of failure and what if I change its format? • What is the reliability impact of changing from SnPb to SAC305 solder? Finally, once the design has been optimized to satisfy the competing requirements, the software can be used to predict the rate of failure over the lifetime of the product and this information used to more accurately plan for the warranty costs. With margins shrinking in the electronics industry, OEMs depend more on profits from extended warrantees. Inaccurate life prediction can cut heavily into this income stream. Under prediction of the failure rate will lead to cost overruns while over estimating failure will mean lost business to competing extended warrantee plans and the setting aside of funds that could instead be used for further product development. This presentation will demonstrate the capabilities and value that this new tool provides to the various functional units within an electronics manufacturing company.|
|Nathan Blattau, Chief Technologist
College Park, MD