Here is the abstract you requested from the MMC_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Reliability of a Chip Scale Packaged (CSP) Enhanced Linear Image Sensor|
|Keywords: chip scale package, Image sensor, Reliability|
|Reliability of electronics devices is an important part of product manufacturing. Since, reliability tests have to be performed in a reasonable amount of time, accelerated life testing is used to predict product life at use conditions. In this paper the reliability of a chip scale packaged (CSP) linear image sensor (ELIS-1024) was investigated. Stress tests were carried out on hardware with and without underfill. The use of underfill in this case was to minimize the effects of stress caused by the differences in the coefficients of expansion of the glass of CSP package and the interposer board. Accelerated reliability tests conducted in accordance with JEDEC standards, were High Temperature Operating Life (HTOL), Low Temperature Operating Life (LTOL), Thermal Cycling (ATC), High Temperature Storage (HTS), and Drop Shock. Failure data were collected and mean life was calculated using a chi-square distribution. No failures were observed in HTOL, LTOL, ATC, and High Temperature Storage test; hence, one failure was assumed at the end of the test for calculation purposes. A comparison of the calculated MTTF with and without underfill test samples indicated that ELIS-1024 devices with underfill have MTTF of ~34 years and devices without underfill have MTTF of ~23 years. Drop testing results for ELIS with and without underfill showed no failures for 45 drops of magnitude 1500 G|
|Awni Qasaimeh, Student