Here is the abstract you requested from the MMC_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|“Manufacturing and Reliability Challenges With QFN.”|
|Keywords: QFN, Reliability, Manufacturing Challenges|
|One of the fastest growing package types in the electronics industry today is the Quad Flat Pack No Lead (QFN). While the advantages of QFNs are well documented, DfR Solutions considers QFN as a ‘next generation' technology for non-consumer electronic OEMs due to concerns with: • Design and Manufacturability • Compatibility with other OEM processes • Reliability Acceptance of this package, especially in long-life, severe environment, high-reliability applications, is currently limited as a result. This presentaion is designed to review specific concerns in relation to design and manufacturability by CMs and OEMs and provide possible mitigations or solutions to allow the reliable introduction of QFN components into products.|
|Greg Caswell, Sr. Member of the Technical Staff
College Park, MD