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Mechanical Behavior of Silver Nanoparticle Films
Keywords: Silver nanoparticles, Tensile, Mechanical Reliability
Silver nanoparticles (Ag-NP) have much lower melting temperatures than the bulk metal, they can be used in low-temperature metallization processes for various applications, such as printed conductive traces on plastics for flexible electronics and microelectronics interconnects. Mechanical reliability of the printed electrodes or interconnects has to be carefully verified because deformation are common in those applications. We demonstrate the mechanical behavior of sintered Ag-NP films in this study. Well dispersed silver nanoparticle ink was flow-coated on PET substrates and annealed at 150 oC for 5 min to form sintered Ag nanoparticle films. Uniaxial stretch and fatigue tests were carried out on the specimen. Results show that Ag-NP films remain conductive with an elongation exceeding 200% and oscillatory stretching to more than 104 cycles. The final resistance of Ag-NP films is ca. 20 times the initial value. Microstructure analysis of MNP films stretched to various degrees shows stages of morphology development, in which delocalized micro-crack formation and reorientation are primarily responsible for relaxing the stress in MNP films, while good adhesion between MNP films and the substrate is responsible for the initial generation and distribution of micro-cracks.
Liwei Huang, Student
Binghamton University
Binghamton, NY

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