Micross

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Techniques and Materials for Advanced Radars and Communications
Keywords: HTCC, LTCC, Radar
The imminent death of ceramic packaging has been a subject of great speculation over the past decade. Instead, requirements for increased reliability and performance coupled with the development of materials and design tools, have actually expanded opportunities. With an available family of ceramics and metals, designers can select materials tailored to their applications. In turn, finite element tools provide accurate predictive models of performance. Examples of the use of LTCC in applications requiring high CTE, low loss and low cost will be cited. Performance and cost comparisons to HTCC will also be presented. The power of RF design, FEA and Signal Integrity tools in the evaluation and design of advanced packages for advanced radars and communications will be highlighted.
Arne Knudsen, GM, Development
Kyocera America, Inc.
San Diego, CA
USA


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