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Metallurgy Change at the Gold-Solder Bump Joint
Keywords: flip chip bonding, Au stud bump, inter-diffusion of metals
Au-solder joint among flip chip bump candidates is economy of time and cost for small scale production. In previous studies, kirkendall effect and bump shape control at the Au-solder joint were discussed. Various IMCs, such as δ-AuSn, ε-AuSn2, η-AuSn4, and kirkendall voids were formed due to fast diffusion of Au into Sn-based solder. Ni was a good diffusion barrier but Ni3Sn4 was formed between Sn3.5Ag solder and electroless Ni. Hourglass shaped bump was obtained by control of solder volume on not-coined Au stud bump. In this paper, different bump profile is going to be examined. Coined Au stud bump was joined to thin film of solder plated with or without Ni barrier. The possibility of eutectic formation will be discussed.
Yong-Bin Sun, Professor
Kyonggi University
Suwon, Kyeonggi-do 443-760,

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