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Moisture Sensing in Microelectronic Packages
Keywords: Hermetic, moisture sensors, near hermetic
This presentation will review state of the art moisture sensing techniques for hermetic and “near hermetic” package designs. A review of the available sensing technology and examples of moisture ingress data will be presented. Leak testing per Mil-Std- 883 only provides a single one time room ambient check of the integrity of the hermetic seal. The reality is for most packages the leak rate changes with time based on temperature, pressure and ambient humidity conditions. Often times perfectly good packages are scrapped, while other times apparently good packages are released into the field, only to fail catastrophically due to excessive amounts of moisture. The solution to this problem is to mount a moisture sensor inside the device and monitor real time moisture ingress into the cavity. This can be done during package qualification or the sensors can be integrated into the final design.
Thomas J. Green, Technical Director
TJ Green Associates LLC
Bethlehem, PA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic