Here is the abstract you requested from the MMC_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Solders in LED Packaging|
|Keywords: LED Die Attach, Au/Sn Soldering, Thermal Interface Materials|
|Successful LED packaging is achieved through a dependable method of attachment. Various methods / materials exist, and possess their own characteristics. The demand for a more robust and brighter LED presents a set of challenges that will need to be addressed. In these cases, a metallic solution offers the attributes required for a successful bond. This presentation will highlight the different product types, associated alloys and process improvements that contribute to this application. One such improvement is a low oxide method of manufacturing AuSn preforms. AuSn is used in high power die attach applications. Other applications and materials to be discussed are: · NanoFoil® used in NanoBonding® · Solder paste printing suggestions · Compressible Metal TIMs or Heat-Springs® used in heat sinking LED packages to a cooling solution. In addition it will cover the different pack methods which can be used for HVM manufacturing.|
|Seth Homer, Product Specialist
Clinton, New York