Micross

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Solders in LED Packaging
Keywords: LED Die Attach, Au/Sn Soldering, Thermal Interface Materials
Successful LED packaging is achieved through a dependable method of attachment. Various methods / materials exist, and possess their own characteristics. The demand for a more robust and brighter LED presents a set of challenges that will need to be addressed. In these cases, a metallic solution offers the attributes required for a successful bond. This presentation will highlight the different product types, associated alloys and process improvements that contribute to this application. One such improvement is a low oxide method of manufacturing AuSn preforms. AuSn is used in high power die attach applications. Other applications and materials to be discussed are: · NanoFoil® used in NanoBonding® · Solder paste printing suggestions · Compressible Metal TIMs or Heat-Springs® used in heat sinking LED packages to a cooling solution. In addition it will cover the different pack methods which can be used for HVM manufacturing.
Seth Homer, Product Specialist
Indium Corporation
Clinton, New York
USA


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