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Process Integrated Quality Control Improves Wire Bonding Reliability
Keywords: quality, wire bonding, reliability
Traditional methods of monitoring wire bond quality employed during semiconductor IC packaging operations, such as non-destructive pull tests, optical inspection and wire deformation monitoring, fail to find 100% of all possible failure modes of an electronic device. As a result, field failures may occur, resulting in costly recalls. To answer the industry's demand for zero failure rates, quality control (QC) systems must go beyond monitoring wire deformation and current characteristics to ensure good bond quality. A variety of signals must be monitored in parallel to ensure different aspects of the bond meet quality standards.
Roberto Gilardoni, Project Manager
Hesse & Knipps Semiconductor Equipment
Paderborn D-33100,

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