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Surface Mounted Components Reflow Process Temperature Profile Study
Keywords: Surface Mount Technology, Reflow Process, Finite Element Modeling
Surface mount devices (SMD) possessing different dimensions have a different thermal response in reflow processing. Small size SMD's have a higher temperature ramping rate than correspondingly larger SMD's during reflow. Creating an optimized ramping rate, which can be used for all the different sizes components, while keeping the small device above melting temperature, is one of the keys to good reflow process control. In this study, an ANSYS multi-physics module was used to simulate the response of different size devices. Different heating methods, for example, Infrared Radiation (IR) and hot air convection oven, will be calculated and compared. A Design of Experiments (DOE) was applied to minimize the time small dimension devices are held above melting temperature. Experimental data were used as validation to the simulation and optimization. A study of Thermal Stress remains as a next step comparison project in the optimization of the temperature profile.
Jianjun Jiang, Ph.D Student
Binghamton Univeristy
Troy, NY

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