Here is the abstract you requested from the Thermal_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Stress Management for Large IC Packages|
|Keywords: high conductivity, low stress, thermal management|
|Thermal dissipation is more important than ever as many recent advances in silicon IC devices have resulted in electronic packages with higher component densities, higher operating speeds, and higher power consumption. The goal of thermal management is to prevent large temperature excursions that lead to reduced performance and/or catastrophic failure. High performance thermal management materials are essential for the efficient transmission of heat from silicon die to heat sink in high power applications and the accommodation of thermal stress in the package. Thermal adhesives are usually either very flexible with low thermal conductivity and low adhesion (i.e. silicones) or very rigid with high thermal conductivity and high adhesion (i.e. epoxies). As a result, conventional thermal adhesive's range of utility is limited in microelectronic packages. A new thermal adhesive has been developed creating a new class of moderately flexible adhesives with high thermal conductivity and high adhesion. The high thermal conductivity combined with a low modulus allows this material to effectively transfer heat out of the package and still dissipate the stress caused by thermal expansion during thermal cycling. This new material provides solutions for the thermal management of large, high performance microprocessors, where exceptional thermal performance and low stress are essential.|
|M. Shane Thompson, Sr. Scientist