Micross

Abstract Preview

Here is the abstract you requested from the Thermal_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Low CTE, High Flux Vapor Chamber
Keywords: Heat Spreader, Vapor Chamber, Low CTE
Advanced Cooling Technologies (ACT) is developing a low resistance, high flux vapor chamber fabricated with a ceramic based envelope. The ceramic is metalized using the direct bond copper (DBC) process to provide a solderable surface. The ceramic envelope has low coefficient of thermal expansion (CTE) and dielectric properties, which accommodate direct chip mounting. Direct chip mounting can eliminate existing package thermal resistances by implementing the chip directly on a heat spreader. Vapor chamber thicknesses of less than 3mm are attainable. Beyond the innovations in fabrication and envelope material, these vapor chambers offer excellent thermal performance. Evaporator resistances of 0.05 K-cm2/W are attainable at heat fluxes over 500 W/cm2. This translates into a heat spreader with an effective thermal conductivity many times that of copper.
Evan Fleming, Product Development Engineer
Advanced Cooling Technologies, Inc.
Lancaster, PA
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems