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Thermal Load Boards Improve Product Development Process
Keywords: Thermal Load Board, Thermal Model Validation, Thermal Management Design
The continuing need to reduce time-to-market design cycles requires parallel design efforts. Electrical, mechanical and thermal design activities all have to occur at roughly the same time. However, the thermal effort often get short shift because greater emphasis is put on the other two activities and because the thermal effort is dependent on the other two for input before the thermal design can begin. Thermal Load Boards (TLBs) are designed to simulate the heat generation of the electrical design within the confines of the mechanical design. These boards can accurately simulate the actual thermal loading of a real printed circuit assembly (PCA) and provide the thermal engineer to evaluate various thermal management solutions with great heat loading flexibility with minimal cost and time expenditure. The key to the TLB design is knowing how to simulate the real heat source components that will be used in the final product design. This presentation will discuss the key aspects of the TLB design and provide some guidelines on heat source simulation.
Bernie Siegal, President
Thermal Engineering Associates, Inc.
Santa Clara, CA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems