Here is the abstract you requested from the Thermal_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thermal Transient Based TIM Material Characterization|
|Keywords: TIM Testing, Thermal Material Characterization, Phase Change Materials|
|A novel method based on existing measurement standards is introduced for a quick and repeatable thermal conductivity measurement of nanoparticle-based thermal greases. The effect of the material, the surface roughness of the DUT fixture is evaluated, as well as a method is introduced for the long term reliability testing of these nanocomposites. Based on the results of the research on the evaluation of this method a possible realization of a TIM testing equipment is introduced which would comply with the standard thermal transient testers available today. The increasing power densities in the latest generation of semiconductor devices have become the major bottleneck of nowadays electronics design. The application of processors in portable computers, DSP chips in home theaters, motor driving power IC-s dissipate more power than ever, resulting in emerging reliability issues. The battle against high temperatures is fought at different levels; out of these the most important is the improvement of the different TIM materials. Companies and research institutes participating in the European Nanopack project are working on the development of TIM materials having higher thermal conductivities as before as well as new methods for the proper characterization of these materials.|