Here is the abstract you requested from the Thermal_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Reliability and Failure Mechanisms of Thermal Interface Materials in Electronic Assemblies|
|Keywords: Reliability, Failure Mechanisms, TIM|
|Reliability and Failure Mechanisms of Thermal Interface Materials in Electronic Assemblies Ryan Verhulst and Radesh Jewram IMAPS ATW September 28-30, 2010 Maintaining acceptable thermal performance in an electronic assembly at end-of-life compared to end-of-line is dependent on the reliability of a thermal interface material (TIM). Poor heat transfer, diminished overall performance and failures are possible if the TIM performance decreases during the manufacturing of the electronic assembly or during its intended lifecycle. In order to select a reliable (TIM), the materials must be chosen such that they will resist chemical and physical degradation when exposed to environmental stresses in harsh environments. The reliability and aging properties of TIMs depends largely on the type of material being used, the environment the material is exposed to and the design of the assembly containing the TIM. This presentation will cover the fundamentals of TIMs and discuss specific reliability issues for pastes and gels, phase change materials, gap filling pads and liquids, and liquid and laminating adhesives.|
|Ryan Verhulst, Engineer