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Thermal Management of a Novel iUHD-Technology Based MCM
Keywords: Multi Chip Module, Finite Element modeling, Buried Die
We examine the thermal performance of a conceptualized Multichip Module (MCM) design for a military application. The design is based on a Draper proprietary MCM technique, iUHD (integrated ultra high density) technology, which provides a multilayer, embedded active / passive, and double sided implementation on a silicon substrate. In order to understand the thermal effects of miniaturizing two Printed Wiring Assemblies into a single MCM iUHD module of 1/10th the surface area, finite element analysis was carried out in ANSYS using empirical and calculated dissipation values of surface and buried components. A foremost concern in this design is the management of thermal energy. Identifying the primary thermal drivers during steady state and transient timeframes directed part placement. The approximately 10 Watt circuit was modeled in different configurations focusing on both single layer and 3D-stack implementations. The CAD models were used to generate a Finite Element (FE) model, capturing the important features of the iUHD fabrication methodology. Transient and steady state thermal analyses were then performed in ANSYS. Results of these studies recommended optimized part placement and heat sink locations to maintain full circuit functionality under load. Copyright 2010 by The Charles Stark Draper Laboratory, Inc. all rights reserved.
William Roy, MCM Design Engineer
Draper Laboratory
Cambridge, MA
USA


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