Abstract Preview

Here is the abstract you requested from the Thermal_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Micro Deformation Technology - A New Manufacturing Process to Create High Surface Area Cold Plates and Base Plates for Liquid Cooling of Power Electronics
Keywords: Cooling, Micro, Liquid
Patterned pin and fin arrays have been applied to cold plates and base plates of liquid cooled power electronics to increase thermal and overall performance. Manufacturing processes available to generate various fin structures have, however, been limited to a small number of techniques, typically in straight channels only, limiting the flexibility of design for the overall liquid cold plate components. A new surface deformation technology has been developed which provides substantial improvement in the variety of fin structures, including a variety of pin fields and channels, enabling an expansion of practical and efficient designs for optimization of fluid flow and thermal performance. In this presentation, Wolverine will demonstrate: • Surface deformation process and it's range and capability. • Relative performance comparison of deformed fin and pin arrays. • Optimization of fin and pin arrays to meet automotive requirements using this deformation technology (spiral pin fins) • Surface deformation applied to IGBT base plates to increase direct cooling performance.
Matt Reeves, Thermal Design Manager
Wolverine Tube, Inc. - MicroCool Division
Huntsville, AL

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems