Abstract Preview

Here is the abstract you requested from the Thermal_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Experimental Study of Rack Level Cooling in a Data Center
Keywords: Data Center Cooling, Rack Level cooling, Telecom Equipment
Telecom equipment have two pre-dominant pathways of airflow for cooling. One set of airflow path is the front to back airflow which is preferred by data center customers. But sometimes telecom gears are also built in a side to side airflow fashion. This poses challenges in a data center due to the fact that hot air can bleed from exhaust of one equipment to inlet of the neighboring chassis. This study explores racks that have been developed to convert airflow from a side to side to front to back for the overall rack. The chassis which has side to side airflow sits inside a rack which is front to back. Different types of airflow cooling strategies for the datacenters are also explored. This will include cold isle to hot isle cooling, air flow directly from the raised floor below to the chassis etc. Detailed experimental results and advantages and disadvantages of each airflow cooling method in the datacenter will also be explored.
Susheela Narasimhan, Technical Leader
Cisco Systems Inc.
San Jose, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic