Here is the abstract you requested from the Thermal_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Development of a New Type Thermal Interface Material (TIM1) for High Power Microprocessors|
|Keywords: Thermal Interface Material, TIM1 , TIM2|
|Henkel has developed a new polymer resin(non-silicone based) suitable for use in the formulations of high performance TIM1. Upon application, it forms a soft polymer gel that withstands solder reflow. The polymer maintains the soft gel characteristics during long term reliability tests such as thermal cycling, high temperature bake. Two types of TIM paste products have been formulated with this resin system: - Type 1 is a polymer paste loaded with thermal conductive fillers. -Type 2 is also a paste loaded with solder powders which upon cure, it will form an interpenetrating network (IPN) of Low Melting Alloy (LMA) in a soft gel polymer matrix. The Thermal Performance of these 2 types TIM candidates will be reviewed and discussed in detail.|
|My Nguyen, Sr. Scientist