Here is the abstract you requested from the Thermal_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Passive 2-Phase Immersion Cooling of Commercial and Developmental IGBT Modules|
|Keywords: Immersion, power electronics, IGBT|
|Recently published work demonstrated the performance capabilities of passive 2-phase immersion for cooling insulated gate bipolar transistors (IGBTs). Modules were hand built with the IGBTs soldered between copper heat spreaders that acted as collector and emitter leads. Testing in an HFE fluid at Patm showed junction-to-fluid resisitivities of R"jf=0.040°C-cm2/W for 0.144 cm2 die at a peak heat flux of 1180 W/cm2 and 55 Amps and 0.11°C-cm2/W for 1.46 cm2 die at a peak heat flux of 550 W/cm2 and 305 Amps (Figure 1). This performance level is competitive with the best emerging pumped water technologies. This presentation includes new performance data from two additional immersion cooling studies. The first was conducted with commercial IGBT modules from the 2006 Lexus LS600h hybrid inverter . Though intended to be sandwiched between ethylene glycol-cooled cold plates (Figure 2), the modules are well suited for immersion cooling. Elimination of the usual ceramic isolators and thermal interface layers reduces Tjf. These modules were modified by soldering heat spreaders which in one case had been modified with a porous metallic boiling enhancement coating (BEC) to reduce the boiling superheat. The second was conducted with hand built modules made from 1.4cm2 die soldered between heat spreaders of varying configurations both with and without a BEC.|
St Paul, MN