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Wire Bond Surfaces for Large Diameter Aluminum Wire and PowerRibbon® Bonding
Keywords: Wire , Bonding, Surfaces
This paper will discuss the various surfaces that are wire bondable for both large diameter aluminum wedge and PowerRibbon® bonding. Surfaces that will be reviewed include: thick film; ceramic and inorganic substrates; Direct Bond Copper as well as other copper surfaces; platings (various types of nickel; silver), power devices and leadframes for housings. It will cover various applications and will discuss problems to avoid.
Mike McKeown,
Orthodyne Electronics Corporation
Mineola, NY

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic