Here is the abstract you requested from the Wirebond_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wire Bond Surfaces for Large Diameter Aluminum Wire and PowerRibbon® Bonding|
|Keywords: Wire , Bonding, Surfaces|
|This paper will discuss the various surfaces that are wire bondable for both large diameter aluminum wedge and PowerRibbon® bonding. Surfaces that will be reviewed include: thick film; ceramic and inorganic substrates; Direct Bond Copper as well as other copper surfaces; platings (various types of nickel; silver), power devices and leadframes for housings. It will cover various applications and will discuss problems to avoid.|
Orthodyne Electronics Corporation