Micross

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Wire Bond Surfaces for Large Diameter Aluminum Wire and PowerRibbon® Bonding
Keywords: Wire , Bonding, Surfaces
This paper will discuss the various surfaces that are wire bondable for both large diameter aluminum wedge and PowerRibbon® bonding. Surfaces that will be reviewed include: thick film; ceramic and inorganic substrates; Direct Bond Copper as well as other copper surfaces; platings (various types of nickel; silver), power devices and leadframes for housings. It will cover various applications and will discuss problems to avoid.
Mike McKeown,
Orthodyne Electronics Corporation
Mineola, NY
USA


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