Abstract Preview

Here is the abstract you requested from the Wirebond_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Conditions for Optimized Deep Access - Gold Ball Bonding Performance
Keywords: Deep-Access, Ball Bonding, Plating
Gold ball bonding has long been a foundational / preferred method for providing a reliable method of interconnection for many microcircuit applications. Among the fundamentals to providing a repeatable and reliable interconnection using this technology, are the selection of the proper surface materials with which to receive the bonds, the cleanliness of those material surfaces, and the selection of the proper tools with which to deliver the bonds. Improper selection / specification of the gold plating, contamination of the gold plating, or improper selection of the wirebond capillary can result in a situation where crescent bond tearing, wirebond non-sticks or non-optimized bonds can be formed. These problems are especially exacerbated in the realm of deep-access gold ball bonding. This study has been targeted to understand under what conditions the gold plating (on a variety of substrate / PWB materials) will provide an optimized condition for bond formation and wirepull results in a deep-access gold ball bonding scenario.
Larry E. Crider, Electrical Engineer
Harris GCSD
Melbourne, FL

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic