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Conditions for Optimized Deep Access - Gold Ball Bonding Performance
Keywords: Deep-Access, Ball Bonding, Plating
Gold ball bonding has long been a foundational / preferred method for providing a reliable method of interconnection for many microcircuit applications. Among the fundamentals to providing a repeatable and reliable interconnection using this technology, are the selection of the proper surface materials with which to receive the bonds, the cleanliness of those material surfaces, and the selection of the proper tools with which to deliver the bonds. Improper selection / specification of the gold plating, contamination of the gold plating, or improper selection of the wirebond capillary can result in a situation where crescent bond tearing, wirebond non-sticks or non-optimized bonds can be formed. These problems are especially exacerbated in the realm of deep-access gold ball bonding. This study has been targeted to understand under what conditions the gold plating (on a variety of substrate / PWB materials) will provide an optimized condition for bond formation and wirepull results in a deep-access gold ball bonding scenario.
Larry E. Crider, Electrical Engineer
Harris GCSD
Melbourne, FL
USA


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