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The Importance of Bond Strength Measurement
Keywords: bondfailure, bondstrength , modeling
Electrical and thermal bonds are such an integral part of electronic and semiconductor construction that they may often be taken for granted. Modern construction methods employ a myriad of bonding processes, each one a vital step in the construction of the final product. A typical consumer product such as a laptop computer may contain hundreds of thousands of bonds yet if one fails it will probably result in a system breakdown. Bond strength measurement is far from the highest profile part of the industry but it has matured with it, in some cases unnoticed. This doesn't alter the fact that a precise knowledge of bond strength quality measurement during product design and subsequent manufacture is directly related to product success and profitability. To serve this need a modern bond test system must be capable of accurately testing bond wires, solder bumps, dies, leads, chips, lids as well as other applications with strengths varying from a few grams force to hundreds of kilograms force. This article investigates the roots of bond testing, outlining what is required to perform a good bond test and what a modern bond tester should be capable of. Proposed Outline • Bond failures either during production or end use can be characterized by design related factors including geometry, materials and processing • Emphasis on bond strength specification and bond testing as a quality control tool to minimize product variability, ensure manufacturing yield and increase product reliability • Precise force displacement measurement allows bond strength modeling to successfully predict the failure mode and can be used as an accurate prediction model of real life loading conditions
Bob Sykes, CTO
XYZTEC
Gilroy, CA
USA


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