Here is the abstract you requested from the Wirebond_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Ribbon Bonding: Qualification Tests, Actual Projects, Problems|
|Keywords: Ribbon Bonding, Automotive, Power Modules|
|The implementation of ribbon bond technology for power modules in the automotive industry can bring considerable advantages compared to the standard wire bond technology commonly used today. Due to the fact that the current capacity of automotive power modules are continuously on the rise, whereas the available overall space is limited or shrinking, ribbon bond technology is one solution to help meet these demands. In this paper, the qualification tests which were carried out at AB Mikroelektronik examine the different ribbon cross sections, different surface treatments, the actual customers projects and corresponding problems will be discussed.|
|Martin Strasser, Student
AB Mikroelektronik GmbH