Micross

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Effects of Rigidity of Adhesively Attached Boards on Heavy Gage Al Wire Bond Performance
Keywords: Al Wire Bond, Adhesive, Wire Bond Surface
With constant market pressure to reduce assembly cost and production time, microelectronic assemblies are becoming more reliant on adhesive attach for wire bonded circuits. In an effort to further reduce cost, assembly designers are attempting to use the same adhesive throughout the package. What may be an acceptable adhesive for a structural attach of a circuit carrier may not be sufficiently rigid for a heavy gage Al wire bond. This paper will discuss the effects of an inadequately attached wire bond surface on such things as bond integrity, tool life, bond formation, and bonding parameters.
William S. Boyce,
Sensata Technologies Inc.
Attleboro, MA
USA


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