Here is the abstract you requested from the Wirebond_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Effects of Rigidity of Adhesively Attached Boards on Heavy Gage Al Wire Bond Performance|
|Keywords: Al Wire Bond, Adhesive, Wire Bond Surface|
|With constant market pressure to reduce assembly cost and production time, microelectronic assemblies are becoming more reliant on adhesive attach for wire bonded circuits. In an effort to further reduce cost, assembly designers are attempting to use the same adhesive throughout the package. What may be an acceptable adhesive for a structural attach of a circuit carrier may not be sufficiently rigid for a heavy gage Al wire bond. This paper will discuss the effects of an inadequately attached wire bond surface on such things as bond integrity, tool life, bond formation, and bonding parameters.|
|William S. Boyce,
Sensata Technologies Inc.