Abstract Preview

Here is the abstract you requested from the Wirebond_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

The Effects of Loop Geometry on Life Test Durability for 10mil Al Wire Bonds
Keywords: Loop Geometry, Al Wire Bonds, Durability
The automotive market continues to drive toward smaller and more complex microelectronic assemblies while at the same time requiring longer life and durability. These often competing considerations are placing a demand on the designers to develop products with greater wire bond interconnect durability. This paper will discuss the effects of loop geometry on such things as life test durability, failure mode, and manufacturing considerations.
William S. Boyce,
Sensata Technologies Inc.
Attleboro, MA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic