Here is the abstract you requested from the Wirebond_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Adverse Effects of Cross Contamination of AgPd Bond Pads During Processing|
|Keywords: AgPd Bond, Silicone Gels, Low Cost Encapsulant|
|As microelectronic assemblies continue to get smaller and more complex, the associated assembly processes get more complex as well. Under hood automotive microelectronic products have become reliant on silicone gels as a relatively low cost encapsulant to protect wire bonds. Cross contamination of silicone gel onto wire bond pads during assembly can be detrimental to the bonding process. This paper will discuss the effects of silicone encapsulant gel contamination on AgPd bond pads.|
|William S. Boyce,
Sensata Technologies Inc.