Here is the abstract you requested from the AIT_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Silicon Interposers Enable 2.5D Assembly|
|Keywords: Design Guidelines, Performance, Stacked Assembly|
|Stacked and 3D IC assembly has been a dominate topic in recent years. However, true 3D assembly entails several radical changes to the IC design, supply chain, and assembly methods. Silicon interposers are being accepted as an essential means of gaining the benefits of 3D with less pain and cost. The so-called 2.5D, or ICs stacked on an interposer uses many of the current conventional design, test and assembly methods. Making a successful 2.5D product requires some different business, design, and material choices. Some of these choices, as studied by one of the leading silicon interposer producers (ALLVIA) will be detailed in the presentation.|
|Phil Marcoux, Consultant