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Thin Films on LTCC for Connectivity and Conductivity
Keywords: Thin Films, LTCC, Connectivity
The topic of this presentation is the development, preparation and characterization of thin metallic multilayer films on Low Temperature Co-fired Ceramic (LTCC) for the purpose of connectivity and conductivity. The conductivity is aimed at the RF single digit GHz frequency range. The aspect of connectivity covers both standard SnPb eutectic solder as well as Au wirebond connections to the same thin film material. This multipurpose thin film material enables the re-appropriation of solder pads for wire bond purposes and vice versa, greatly enhancing the flexibility of the substrates. Thin film preparation and pattern generation for traces and pads will be discussed. Qualitative and quantitative results for adhesion and performance with respect to the various functions will be presented, as well as a detailed study of the thin film integrity and robustness.
Dr. J. Ambrose Wolf, Scientist Principal R&D
Honeywell FM&T
Kansas City, MO

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic