Here is the abstract you requested from the CICMT_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Thin Films on LTCC for Connectivity and Conductivity|
|Keywords: Thin Films, LTCC, Connectivity|
|The topic of this presentation is the development, preparation and characterization of thin metallic multilayer films on Low Temperature Co-fired Ceramic (LTCC) for the purpose of connectivity and conductivity. The conductivity is aimed at the RF single digit GHz frequency range. The aspect of connectivity covers both standard SnPb eutectic solder as well as Au wirebond connections to the same thin film material. This multipurpose thin film material enables the re-appropriation of solder pads for wire bond purposes and vice versa, greatly enhancing the flexibility of the substrates. Thin film preparation and pattern generation for traces and pads will be discussed. Qualitative and quantitative results for adhesion and performance with respect to the various functions will be presented, as well as a detailed study of the thin film integrity and robustness.|
|Dr. J. Ambrose Wolf, Scientist Principal R&D
Kansas City, MO