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Electroless Nickel and Gold Plated Silver LTCC Solution for Advanced Hermetic Packages
Keywords: Low Temperature Cofired Ceramic, Nickel Gold Plating of Silver Metallization, Reliability Testing of Brazed LTCC Packages
Low Temperature Cofired Ceramics (LTCC) for military and medical applications requires high reliability interconnects that have been traditionally met using Gold metallization, but due to the rising cost of Gold, it has become cost prohibitive in some applications to tier 1 defense contractors. The utilization of Silver metallization reduces the costs of LTCC up to 50%, however requires proper coverage using either a Mixed Metal, or Nickel and Gold Plating. Efforts to date on mixed metal solutions with resistive PdAg or PtAg transitions without Kirkendahl voiding have been unreliable for systems requiring post fire metallizations due to voiding at the silver to gold transition. Anaren Ceramics has developed an all Silver LTCC solution that utilizes Electroless Nickel and Gold plating, lowering the cost of entry for LTCC users up to 50%. Anaren Ceramics' proprietary plating process for the DuPont 951 LTCC tape material and silver metallizations meets the needs of high reliability, high cavity count LTCC packages that are fully solderable using AuSn, or PbSn materials for hermetic applications. The Anaren Ceramics solution meets Mil Std 883 test requirements. In the presentation we will discuss the test results for plated LTCC substrates and AuSn brazed LTCC assemblies that include 350C Bake Test, Tape Peel, Gold Tin Braze Flow via X Ray, Open Header Leak Rate, Moisture under Bias, Salt Atmosphere, Die Shear, Wire Bond, Ball Shear, and Pin Pull.
David Ross, Sr. Process Development Engineer
Anaren Ceramics Inc.
Salem, NH
USA


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