Micross

Abstract Preview

Here is the abstract you requested from the CICMT_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Waveguide Inductive Strip Filter Embedded in LTCC
Keywords: Microwave Filter, Waveguide Inductive Strip, LTCC
Microwave filters are generally designed with microwave transmission lines such as microstrip and stripline. However these filters are typically lossy. The waveguide filters using conventional inductive elements such as metal rods and transverse diaphragms have some disadvantages such as complicated structure, high cost and hard to put into mass production. A novel waveguide inductive strip filter embedded in LTCC is introduced. The disadvantages of the conventional waveguide filters are eliminated. By using LTCC technology, the cost will be typically lower; it can be put into mass production, and can be tested easily. The equivalent T-network parameters of the inductive strip mounted in waveguide and embedded in LTCC substrate were derived. A new iterative technique was used based on the Variation Method. The design formulas and curves of the filter are presented. The design method of the filter was derived by applying the equivalent network of the inductive strip to the usual method of the filter design. A complete set of new curves relating the various filter parameters are introduced. Similar curves can be derived to design similar filters for any frequency band using any dielectric material. Three-dimensional electromagnetic field modeling and simulation was carried out using HFSS (High Frequency Structure Simulator). An optimization process was done for the designed filter. The modeling and the optimization S-parameters curves are shown. This paper introduces a new methodology of designing waveguide inductive strip filters embedded in LTCC. The design methodology is derived and presented with formulas and curves. The design steps are explained and verified by examples and results.
Ehab Abousaif, PhD Cadidate
University of Idaho, Department of Electrical and Computer Engineering
Moscow, ID
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems