Here is the abstract you requested from the CICMT_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A Novel Approach to the Measurement and Characterization of Losses Due to Surface Roughness in High Speed Transmission Lines|
|Keywords: Characterization, Simulation, Interconnect Losses|
|An efficient and accurate measurement technique is required to fully characterize the losses observed at high frequencies in transmission lines. Industry is calling for accurate models to characterize these losses seen at high frequencies in other to meet the high speed data transfer rates that future applications will demand. The nature of conductor losses is not well understood at high speeds. For example, conductor losses attributed to rough surface copper foils used for better adhesion to dielectric substrate is known to deviate from industry models at frequencies above 5GHz. It is important to have accurate models of these losses in other to ensure signal and power integrity. This paper will show a measurement technique that implements the multiline TRL algorithm for the extraction of propagation coefficient of striplines test coupons using a vector network analyzer (VNA). Once the propagation coefficient is extracted, losses due the dielectric substrate will be extracted from the propagation coefficient using a full wave computational analysis method. An identical dielectric laminate will be used for the fabrication of stripline test coupons with different widths, the dielectric losses extracted are the same for both transmission lines. Using this property, the dielectric loss is then subtracted from the total loss of the microstrip to attain the total conductor loss, assuming that losses due to radiation are negligible. The extracted conductor loss will be compared to both classical models for surface roughness as well as existing commercial full wave computational analysis and based on these results, a predictive model of losses due to surface roughness will be derived. The proposed methodology is applicable to surface roughness loss characterization of both organic and ceramic packaging materials.|
|Femi Akinwale, Graduate Student
San Diego State University
San Diego , CA