Here is the abstract you requested from the CICMT_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|A Low Loss Fully Embedded Stripline Parallel Coupled BPF for Applications using the 60 GHz Band|
|Keywords: LTCC, embedded Filter 60 GHz, Simulation|
|This paper presents a low loss fully embedded bandpass filter (BPF) suitable for multilayer System-in-Package (SiP) and Multi-Chip-Module (MCM) applications, e.g. wireless applications using the unlicensed 60 GHz band. A main advantage of the LTCC technology is the 3D capability. A fully embedded filter reduces radiation and cross coupling effects to other microwave structures. Furthermore, the smaller size and the embedding of the BPF save substrate space for miniaturization and cost reduction. For the BPF an embedded stripline parallel coupled filter structure was selected. To avoid parasitic or higher order wave modes the filter was encapsulated using solid metallization layers on top and bottom as well as via fences on both filter sides. The LTCC-material Du Pont 943 was used, which exhibits excellent RF performance. An adaption to the new Du Pont 9k7 system is being considered as well. 3D simulations were made using the 3-D full wave EM-Simulator HFSS™ from Ansoft. The primary objective of the filter design and optimization process was to achieve a return loss of more than 10 dB and an insertion loss less than 2.0 dB at the center frequency, a 3 dB bandwidth from 56 GHz up to 65 GHz plus a steep slope in the vicinity of the passband. A probe tip port for on wafer measurement and a microstip-to-stripline transition were also optimized to evaluate the filter performance. Therefore, optimization of the signal path RF properties was essential. The major challenge in such an arrangement is maintaining the impedance matching along the entire signal path. The BPF structure including the microstrip-to-stripline transition and the probe tip port are still under manufacturing now. The simulation and complete measurement results will be presented in the full paper. The paper addresses technological requirements, simulation efforts and microwave material and module properties.|
TU Ilmenau - University of Technology
Ilmenau, Thuringia 98693,