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An Investigation of the Process Stability of RF SiP made of DuPont 943 and 9K7
Keywords: System-in-Package, LTCC, Process Stability, RF Packaging
RF packaging is one of the most challenging topics for LTCC technology. It is particulary capable for advanced packages and systems-in-package because of its electrical, functional, thermo-mechanical properties as well as the excellent long-term stability and reliability. LTCC combines the potential for miniaturization, the demand for low loss handling of high frequencies up to the 110 GHz and the opportunity to integrate additional features. Therefore it has to run through various manufacturing steps and several refirings without any decrease of their performance or loss of dimensional accuracy. This paper discusses the impact of thermal post processing on RF characteristics and geometrical properties. LTCC substrates with radar front ends, calibration structures and other test vehicles made of Du Pont 943 and 9k7 Green Tapeâ were cofired following the recommended conditions and refired several times in order to investigate and compare the influence of the postfiring. The flatness, dimensions and performance of the ceramics up to 110 GHz were evaluated and compared.
Thomas Bartnitzek, Technical Director
VIA electronic GmbH
Hermsdorf, Thuringia 07629,
Germany


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