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3D Ceramic Interconnect Devices
Keywords: 3 D Technology, 3 D packaging, Solution for 3 D packages
3D packaging aims at reducing footprint and cost, improving performance and creating a new function. Electronic packaging technologies include stacking, multilayer and vertical interconnect concept. Packaging can also take advantage of 3D interconnect devices that combine mechanical and electrical functions on a single part, with advantages in design freedom, reduction in assembly and inventory costs, enhanced reliability. Most recent developments are related to molded thermoplastics parts and led to the naming of ‘3D-MID' which stands for 3D-Molded Interconnect Devices. However, when dimensional stability becomes a major issue in the fabrication process or the application constraints, ceramic 3D devices can represent the solution. Very few companies have so far been involved in the manufacturing of molded or precision-machined structural ceramics with added metallization patterns on 3D shaped surfaces. Compared to thin or thick-film techniques which are inherently limited to flat surface technologies, laser structuring appears to be better suited to make 3D interconnect circuits. Indeed, as a non-contact technique, laser can process any surface as long as it is accessible to the beam, circuit patterns can be routed in cavities, on a cube, sphere, cone shape, etc… Typically, the circuit is achieved by a substractive manner on a structural part that has been first metalized with thin film deposition techniques. Design rules have to be followed however for reliability and cost purposes. Fast processing is guaranteed with beam scanning and part positioning with a multi-axes motion system. This paper presents this technology and will review the main features, advantages and limitations that can be experienced, along with some examples of manufactured products and applications.
Dr. Pascal Metayer, Laser Machining Manager
Microcertec S.A.S.
Collegien 77090,
France


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