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Flip Chip for Image Sensor Packaging
Keywords: flip-chip, fluxless, camera
The use of flip chip interconnects for image sensor packaging provides several unique challenges during packaging as well as benefits to the customer. The principal challenges during assembly include the requirements of: no contamination of the image sensor during reflow, fabrication of a sealing structure to prevent future environmental contamination of the image sensor, and fabrication of a solder joint structure for the seal ring that can pass pre-conditioning. To achieve these requirements, the use of a fluxless solder reflow process and transient liquid phase (TLP) bonding will be explained. Benefits to the customer for this type of flip chip image sensor packaging as compared to chip on board (COB) and thru silicon via (TSV) packages is a thinner camera module and versus TSV packages the ability to pass all required reliability tests without the use of an underfill. Reliability test results will be shown for thermal cycling, drop, and bending tests.
Deok-Hoon Kim, Ph.D., President & CEO
OptoPAC
Oksan-Myun, Cheongwon-Gun, Chungbuk 363-911
Korea


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