Here is the abstract you requested from the DPC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Silicon Interposers enable high performance capacitors|
|Keywords: Interposer, Capacitors, TSVs|
|Thin film capacitors without TSVs have been used previously. However, with the interconnect inductance being high, benefits of thin film capacitors have not been fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors. TSVs with their very low inductance interconnects thus will enable very high electrical performance when integrated with embedded thin film capacitors. ALLVIA, on behalf of it's foundry customers, has been conducting studies of various capacitors on silicon interposers. The data presented in this paper shows after several thermal cycles that planar capacitors on silicon results in stable, reliable capacitors operating at very high frequencies. Unlike an issue of parallel resonance seen with chip capacitors, planar capacitors in interposers don't exhibit this property.|
|Dr. Sergey Savastiouk, President