Here is the abstract you requested from the DPC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Results and Learning from 3D-IC MPW Runs|
|Keywords: Bonding, High-density, MPW|
|Tezzaron has worked for several years in the area of 3D integrated circuit development. During 2010, 3 different multiproject wafer runs targeting 2 to 5 layer 3DICs for several different customers were started. Tezzaron's perspective on the results of those runs, issues, and futures will be discussed.|
|Robert Patti, CTO
Tezzaron Semiconductor Corp.