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Results and Learning from 3D-IC MPW Runs
Keywords: Bonding, High-density, MPW
Tezzaron has worked for several years in the area of 3D integrated circuit development. During 2010, 3 different multiproject wafer runs targeting 2 to 5 layer 3DICs for several different customers were started. Tezzaron's perspective on the results of those runs, issues, and futures will be discussed.
Robert Patti, CTO
Tezzaron Semiconductor Corp.
Naperville, IL
USA


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