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Results and Learning from 3D-IC MPW Runs
Keywords: Bonding, High-density, MPW
Tezzaron has worked for several years in the area of 3D integrated circuit development. During 2010, 3 different multiproject wafer runs targeting 2 to 5 layer 3DICs for several different customers were started. Tezzaron's perspective on the results of those runs, issues, and futures will be discussed.
Robert Patti, CTO
Tezzaron Semiconductor Corp.
Naperville, IL

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