Abstract Preview

Here is the abstract you requested from the DPC_2011 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Towards Making 3D Submicron Interconnects by Motion Controlled Direct-Writing of Metal Wires
Keywords: Electrodeposition, Wirebonding, Submicron Interconnect
Significant challenge exists in electronics industry in downsizing, to a few micrometers, of the wire bonds required for wiring integrated chips with circuit board. We developed an electrodeposition method exploiting the dynamics stability of a microscale/nanoscale liquid meniscus to “write” pure Cu and Pt solid three dimensional structures of designed shapes and sizes in an ambient air environment. We demonstrated an automated wire bonding process that downsized the wire diameter to less than 1 micron and the bond size to below 3 micron with a breakdown current density of over 10^11 A/m2 for the wire bonds. The technology was used for fabricating high density and high quality interconnects and for creating complex three dimensional microscale and even nanoscale metallic structures.
Min-Feng Yu, Associate Professor
University of Illinois at Urbana-Champaign
Urbana, IL

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems