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3D Transmission Line Design for High Power RF Components in Laminates
Keywords: Interconnect, thermal analysis, via hole
High power (> 30 dBm) RF components such as switches, passives and RF MEMS can be embedded in an advanced 3D package in laminates. We report a novel transmission line and interconnection design for these embedded high power devices. Typical RF signal path consists of input signal lines (microstrip sand coplanar waveguides), interconnections between laminate layers, and RF devices. 3D configurations of multiple buried via holes are first simulated in the HFSS environment and then tested on laminate prototypes for optimized RF performance. Loss points are carefully identified and removed in the design by distributing RF current in a network of interconnections. Extra cooling considerations are included to significantly reduce thermal stress on the system as well as individual components. The final transmission line design can supply over 50 W of RF power into a 12 layer laminate system.
Sungjun Kim, Student
University of California, Irvine
Irvine, CA
USA


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